Designed for light to medium polishing, this compound gently removes holograms and buffer trails, making it ideal for refining paintwork after using more aggressive compounds. Features a patented hexagonal grooved surface design that enhances surface contact, minimizes heat buildup, and prolongs the lifespan of both the pad and the machine. Includes vent holes that efficiently release heat and reduce stress on the pad’s center, maximizing surface contact, reducing wear and tear, and extending the pad’s lifespan.
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